婷婷97狠狠成人网站,国产激情无码一区二区三区,少妇激情偷公乱140章,精品香蕉一区二区三区

Chizhou Hisemi Electronic Technology Co., Ltd. was established in October 2014. It is a high-end electronic information manufacturing enterprise focusing on integrated circuit packaging and testing business, including integrated circuit packaging, wafer testing services and chip finished product testing services. In the packaging field, it has core technologies such as multi chip module (MCM) packaging, three-dimensional (3D) stacked core packaging, miniaturized flat pinless (QFN / DFN) packaging, high-density micro spacing integrated circuit packaging and so on.